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Pmdtechnologies and Infineon develop 3D depth-sensing technology for enterprise metaverse

Categories Edge Computing News  |  Hardware
Pmdtechnologies and Infineon develop 3D depth-sensing technology for enterprise metaverse

Pmdtechnologies, a provider of 3D Time-of-Flight (ToF) sensor technology, has collaborated with Infineon to develop 3D depth-sensing technology for the next-gen Magic Leap AR headset. Later this year, Magic Leap is expected to announce Magic Leap 2, an AR headset targeted for enterprise markets. The new headset is expected to include powerful computing and advanced optics that include the 3D indirect-Time-of-Flight (iToF) depth-sensing technology.

The co-developed 3D depth-sensing technology provides an accurate 3D mapping of the environment as well as 3D images of faces, hand details, and objects in the surrounding of the AR headset. The chip’s 3D depth-sensing will also enable the AR headset to interact through real-time gesture controls. The technology will help Magic Leap to optimize the power consumption, reducing heat and increasing the battery life.

“Sensing the environment precisely and in real-time is key for augmented reality applications,” says Magic Leap CTO, Julie Green. “Magic Leap 2 will provide an even more immersive user experience. These superior functionalities will help to connect the physical and digital world even more seamlessly.”

The AR headset demonstrates the potential of the REAL3 3D image sensor and comes with the improved IRS2877C Time-of-Flight imager that captures the surrounding environment around the user. Also, the 3D imager’s VGA resolution enables the Magic Leap 2 AR headset to understand and interact with the physical environment appropriately.

The Magic Leap 2 will be demonstrated at the Hannover Messe 2022 where users can experience the next-gen AR headset for enterprises and explore the potential capabilities of 3D depth-sensing technology. The incorporation of advanced sensing technology is the key to improving user experience and its applicability in industrial and medical setups, the companies say. The technological advancements in 3D depth-sensing will open the doors for new use cases in the medical industry where applications like AI-powered anatomical segmentation visualization software with spatial computing from Magic Leap can be performed.

“We have introduced our 3D imager technology in a professional environment, where precision and reliability are life-saving features,” says Andreas Urschitz, Division President of Power & Sensor Systems and designated CMO at Infineon. “The latest 3D time-of-flight technology is going to enable new augmented and mixed reality applications for healthcare and industry. It’s about to change the way we live and work fundamentally.”

What’s in it for the future of metaverse?

Chips such as the ones being developed by Pmdtechnologies are essential building blocks of the metaverse. The processing of obtaining depth, length and width information electronically to improve the human-computer interfaces is called 3D depth sensing. Some of the applications involving 3D depth-sensing are 3D reconstruction, scene perception for virtual reality and augmented reality technologies. The recent technological breakthroughs in 3D depth-sensing are due to the growing demands for enhanced computer vision capabilities that enable the devices to analyze the surroundings and develop new use cases for a broad range of markets and applications.

Metaverse applications require a proper understanding of the 3D environment where 3D depth-sensing technologies are used to create metaverse and AR/VR-related products. Reconstruction of objects using 3D sensors is an essential aspect of any metaverse product or service as most of the applications require digitizing objects and the human body for a virtual environment. The use of 3D depth-sensing in virtual reality or augmented reality can combine real-world 3D images with computer-generated projections to create supplement visual experiences.

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