Winbond launches CUBE for edge AI computing use cases
Semiconductor memory solutions provider Winbond Electronics Corporation has unveiled a new technology for edge AI computing in mainstream use cases….
Semiconductor memory solutions provider Winbond Electronics Corporation has unveiled a new technology for edge AI computing in mainstream use cases….
StackPath, an edge computing platform, recently announced that its virtual machines and containers are now available on Google Cloud Marketplace….
The recently published 2023 Edge AI Technology Report delves into the present landscape of edge AI, showcasing its diverse applications…
At Embedded World 2023, Qualcomm Technologies demonstrated new technologies and products to power connected IoT and edge devices. The technology…
5G Open Innovation Lab (5G OI Lab) has announced that e&, an international telecommunications company, has joined the Lab’s innovation…
By Tony Grayson, General Manager, Compass Quantum There are many observers in the data center industry that have closely followed…
Nokia and Bosch have collaborated to develop precision positioning technology for industrial automation using a private 5G network. The companies…
PCIMG has announced that the new computer-on-module (COM) Express 3.1 specification can now support high-speed serial interfaces such as Gen…
The Open Grid Alliance (OGA) has announced that Las Vegas will be the first city to pilot its Innovation Zone…
Deutsche Telekom and RTL Deutschland recently broadcasted live TV content using a 5G standalone network for the first time, leveraging…