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Lantronix debuts new SiP modules and supporting dev kits for IoT applications

Lantronix debuts new SiP modules and supporting dev kits for IoT applications

Lantronix, a company that provides IoT solutions, has grown its Open-Q product line with the launch of an entry-level Open-Q 2290CS System-in-Package (SiP) and a more advanced Open-Q 4290CS SiP. The company aims to accelerate the prototyping and development of applications that involve image processing and computer vision.

“With the expansion of the Open-Q family, Lantronix continues to deliver powerful platforms for the development of IoT products that are supported by world-leading Qualcomm technology,” said Paul Pickle, the chief executive officer of Lantronix.

The Lantronix Open-Q 2290 SiP is an entry-level application processor that delivers advanced graphics, connectivity and camera capabilities. The company says that the Open-Q 2290 SiP is designed for various industrial Internet of Things (IoT) applications, including handheld devices, control panels, point-of-sale systems and kiosks, vending machines, and exercise equipment.

Meanwhile, the Lantronix Open-Q 4290 SiP is an affordable, high-performance SoC designed for advanced AI vision applications. It features Wi-Fi 5 with some Wi-Fi 6 features, enhanced security, powerful camera capabilities and a broad range of connectivity options. According to the company, the included development kit and OS/SDKs make it easy to create new products with advanced imaging and computer vision performance in low-cost, low-power embedded environments.

The company says that the accompanying Open-Q AL development kits can accelerate prototyping and minimize the time to market. They are optimal for applications that involve image processing and computer vision. These cost-effective development modules support various input/output interfaces, including display, camera, audio and USB.

“Our long-standing experience with Qualcomm Technologies enables us to deliver a wide variety of development solutions and support the quick and cost-effective delivery of innovative IoT and edge-computing solutions to market,” Pickle added.

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