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Avassa secures H&M Group as a strategic investor with new round of funding

Avassa, a Swedish edge application management platform, has secured new funding with H&M Group joining as a strategic investor along…

 

Biden administration invests $269M to boost edge computing capabilities in microelectronics sector

The Biden-Harris Administration announced $269 million in funding for microelectronics manufacturing and workforce development. This investment is part of the…

 

Nearby Computing closes €6.5M for global expansion

Nearby Computing, a platform for edge computing orchestration and automation based in Barcelona, announced a €6.5 million Series A funding…

 

Blaize secures $106 million to accelerate edge AI computing solutions

Blaize, an AI computing provider utilizing edge computing solutions, has raised $106 million as the company supercharges its efforts in…

 

Sima.ai secures $70 million in funding to develop second-generation MLSoC

Sima.ai, a company specializing in machine learning system-on-chip (MLSoC) platforms, has secured $70 million in funding. This investment round, led…

 

Flexnode to transform the data infrastructure landscape with $9 million capital raised

Flexnode, a player in the data infrastructure sphere, recently shifted gears with its successful funding round. Raising $9 million in…

 

Synadia secures $25 million funding for AI-powered multi-cloud and edge computing demands

Open source cloud and edge-native messaging system Synadia Communications has closed a $25 million Series B financing round to accelerate…

 

Skylo Technologies secures $37 million in funding round led by tech industry heavyweights

Skylo Technologies, a satellite connectivity service provider, secures $37 million in funding co-led by Intel Capital and Innovation Endeavors. Among…

 

Couchbase secures a $25 million loan with MUFG Bank

Couchbase recently announced its entry into a material definitive agreement. Specifically, Couchbase, Inc. has secured a senior secured revolving loan…

 

Semron’s mobile AI chips attract $7.9 million in seed funding

Dresden-based company Semron has successfully raised $7.9 million in seed funding for its AI chips featuring 3D packaging designed for…

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