Aetina and Mobilint join forces to advance low-power edge AI systems
Aetina, an edge AI device manufacturer and Mobilint have forged a strategic Memorandum of Understanding (MOU) to accelerate the global commercialization of edge AI solutions.
The collaboration leverages Mobilint’s low-power-semiconductor technology with Aetina’s AI hardware ecosystem to address industry demands in smart manufacturing, smart cities, security, and robotics.
The MLX-A1 AI Box is the demonstration vehicle for Mobilint’s silicon technology along with Aetina’s system integration for autonomous local-compute AI inference workloads.
“This collaboration with Mobilint not only introduces differentiated AI semiconductor technology into Aetina’s edge computing platforms, but also provides customers with innovative value that combines performance and price competitiveness,” says Joe Lo, president of Aetina. “Looking ahead, both parties will continue to expand cross-industry collaborations projects, strengthen global market deployment and jointly promote to drive widespread adoption of edge AI.”
Both firms aim to further cross-industry partnerships and global market roll-out to accelerate widespread implementation of edge AI.
Mobilint specializes in high-performance, low-power AI semiconductors, including AI SoCs and AI ASIC accelerator cards, optimized for real-time AI deployment, while Aetina provides scalable edge AI computing platforms, leveraging NVIDIA GPU-accelerated systems and modular AI hardware.
Aetina and Mobilint will integrate their technologies and resources to provide optimized solutions, advancing the future of edge AI innovation.
Aetina recently launched small volume “Preview Kits” for NVIDIA Jetson Thor, dedicated AI applications for advanced robotics and physical AI applications.
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Article Topics
Aetina | edge AI | edge computing | Mobilint | semiconductor | Smart Manufacturing
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